사진 제조업체부분# 주식 가격 재다 데이터 테이블 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
XR2C-0311-N

XR2C-0311-N

CONN SOCKET SIP 3POS GOLD

Omron Electronics Inc-EMC Div

2556 0.60
- +

카트에 추가

지금 질의

XR2C-0311-N

Datasheet

Bulk XR2 Active SIP 3 (1 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2A-1401-N

XR2A-1401-N

CONN IC DIP SOCKET 14POS GOLD

Omron Electronics Inc-EMC Div

451 2.71
- +

카트에 추가

지금 질의

XR2A-1401-N

Datasheet

Bulk XR2 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2C-2011-N

XR2C-2011-N

CONN SOCKET SIP 20POS GOLD

Omron Electronics Inc-EMC Div

612 3.06
- +

카트에 추가

지금 질의

XR2C-2011-N

Datasheet

Bulk XR2 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2A-0802

XR2A-0802

CONN IC DIP SOCKET 8POS GOLD

Omron Electronics Inc-EMC Div

247 3.60
- +

카트에 추가

지금 질의

XR2A-0802

Datasheet

Bulk XR2 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2C1011N

XR2C1011N

CONN SOCKET SIP 10POS GOLD

Omron Electronics Inc-EMC Div

353 2.28
- +

카트에 추가

지금 질의

XR2C1011N

Datasheet

Bulk XR2 Active SIP 10 (1 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Threaded - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polybutylene Terephthalate (PBT), Glass Filled
XR2A-0825

XR2A-0825

CONN IC DIP SOCKET 8POS GOLD

Omron Electronics Inc-EMC Div

252 2.09
- +

카트에 추가

지금 질의

XR2A-0825

Datasheet

Bulk XR2 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2A-1411-N

XR2A-1411-N

CONN IC DIP SOCKET 14POS GOLD

Omron Electronics Inc-EMC Div

2495 2.63
- +

카트에 추가

지금 질의

XR2A-1411-N

Datasheet

Tube XR2 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2A-1801-N

XR2A-1801-N

CONN IC DIP SOCKET 18POS GOLD

Omron Electronics Inc-EMC Div

2833 3.10
- +

카트에 추가

지금 질의

XR2A-1801-N

Datasheet

Bulk XR2 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2P2041

XR2P2041

CONN SOCKET SIP 20POS GOLD

Omron Electronics Inc-EMC Div

100 8.12
- +

카트에 추가

지금 질의

XR2P2041

Datasheet

Bulk XR2 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Threaded - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polybutylene Terephthalate (PBT), Glass Filled
XR2A-0815

XR2A-0815

CONNECTORS - CONNECTOR

Omron Electronics Inc-EMC Div

107 0.89
- +

카트에 추가

지금 질의

XR2A-0815

Datasheet

Box * Active - - - - - - - - - - - - - -
XR2A-1611-N

XR2A-1611-N

CONN IC DIP SOCKET 16POS GOLD

Omron Electronics Inc-EMC Div

2723 2.55
- +

카트에 추가

지금 질의

XR2A-1611-N

Datasheet

Bulk XR2 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2A-2411-N

XR2A-2411-N

CONN IC DIP SOCKET 24POS GOLD

Omron Electronics Inc-EMC Div

3395 4.45
- +

카트에 추가

지금 질의

XR2A-2411-N

Datasheet

Bulk XR2 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2A-3201-N

XR2A-3201-N

CONN IC DIP SOCKET 32POS GOLD

Omron Electronics Inc-EMC Div

3308 6.35
- +

카트에 추가

지금 질의

XR2A-3201-N

Datasheet

Bulk XR2 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2C-2005

XR2C-2005

CONN SOCKET SIP 20POS GOLD

Omron Electronics Inc-EMC Div

2646 5.54
- +

카트에 추가

지금 질의

XR2C-2005

Datasheet

Bulk XR2 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2A0815

XR2A0815

CONN IC DIP SOCKET 8POS GOLD

Omron Electronics Inc-EMC Div

3289 1.95
- +

카트에 추가

지금 질의

XR2A0815

Datasheet

Bulk XR2 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polybutylene Terephthalate (PBT), Glass Filled
XR2C-3205

XR2C-3205

CONN SOCKET SIP 32POS GOLD

Omron Electronics Inc-EMC Div

2960 7.77
- +

카트에 추가

지금 질의

XR2C-3205

Datasheet

Bulk,Box XR2 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2A-0811-N

XR2A-0811-N

CONN IC DIP SOCKET 8POS GOLD

Omron Electronics Inc-EMC Div

3037 0.96
- +

카트에 추가

지금 질의

XR2A-0811-N

Datasheet

Bulk,Box XR2 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2C-1611-N

XR2C-1611-N

CONN SOCKET SIP 16POS GOLD

Omron Electronics Inc-EMC Div

3098 1.34
- +

카트에 추가

지금 질의

XR2C-1611-N

Datasheet

Bulk,Box XR2 Active SIP 16 (1 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2C-1501-N

XR2C-1501-N

CONN SOCKET SIP 15POS GOLD

Omron Electronics Inc-EMC Div

2830 2.29
- +

카트에 추가

지금 질의

XR2C-1501-N

Datasheet

Bulk XR2 Active SIP 15 (1 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
XR2A-1601-N

XR2A-1601-N

IC CONNECTOR

Omron Electronics Inc-EMC Div

3324 2.83
- +

카트에 추가

지금 질의

Bulk * Active - - - - - - - - - - - - - -
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